Work Achievement:
Journal Editor / Guest Editor
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Materials Today – Proceedings (Scopus and CPCI Indexed) on Science Direct & Elsevier platform for Proceedings of 10th International Conference on Materials Processing and Characterization - 2020 (10 ICMPC 2020).
Awards/Honors/ Recognitions
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International Executive Committee Member of International Conference on Materials Processing and Characterization
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International Travel Support, DST-SERB, Govt. of India, to attend an International conference held at University of Tokyo, Tokyo, Japan.
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Senior Research Fellow (SRF) on a project sponsored from Bhabha Atomic Research Center (BARC), Trombay, Mumbai.
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Research Fellowship, MHDR, India
Expert / Invited Lecture Delivered
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Expert Lecture delivered in Short Term Training Program on the Topic "Advances and Challenges in Materials and Manufacturing" at BIET, Jhansi, U.P., India on 6th Nov. 2019.
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Invited Lecture delivered in 1st One Week International Faculty Development Program-ONLINE on “Research and Development in Materials Behavior, Processing and Characterization Techniques, (RDMBPCT-2020)” during 9th June 2020 to 14th June, 2020 organized by the department of Mechanical engineering, GLA University and the Indian Institute of Metals (IIM) Mathura Chapter in association with Mechanical Engineering Department, Punjab University, Chandigarh
Instrumental Skill
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Operation and troubleshooting (selected) of Thermo-mechanical simulator (Gleeble-3800®) – a dedicated machine for different hot working process, such as compression, tensile test, Heat affected zone test, torsion test etc. manufactured by Dynamic Systems Inc., USA.
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Operation of Field Emission Scanning Electron Microscope (FE-SEM) model FE-SEM Quanta 200® FEG for SEM and EBSD images.
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Operation of Leica Microscope-Familiar with Leica® 5000m, used to capture the optical images of microstructure with the magnification of 50x to 1000x.
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Operation of Instron tensile testing machine (INSTRON TEST 28250®) made in German.
Computer Skills
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HyperXtrude software (dedicated to extrusion process based on Finite Element Analysis)
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TSL-OIMTM EBSD software (An analysis software to get different microstructural feature obtained through Electron Backscattered Diffraction, EBSD measurement.
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Material Studio 6.0 (Accelrys Inc.)
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Preliminary knowledge to work with LAMMPS (MD Simulator Open ware)
Administrative responsibilty at Departmental level
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Year coordinator of IInd Mechanical B. Tech. students from July 2017 to June 2019. Taking care of smooth conduction of academics in IInd year.
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Member of Research Promotion Cell of GLA University Mathura.